Flip chip, also known as controlled collapse chip connection (C4), is used for interconnecting semiconductor devices, such as IC chips, microscopic devices, micro sensors, and microprocessor, to external circuitry while utilizing deposited solder bumps onto the chip pads. Use of flip chip interconnections offers numerous advantages over conventional wire bond, which includes superior thermal and electrical performance, reduced form factors, well-defined construction, substrate flexibility for varying performance requirements, and the highest I/O capability.

The flip chip market is majorly driven by the imminent need of circuit miniaturization, growth in internet of things (IoT), and technological superiority over wire bonding. However, the major restraints associated with the flip chip industry include the huge initial investment required for setting up new manufacturing facility and less available options for customization. Moreover, growth in demand of sensors in smartphone industry and increase in application in personal electronic devices, such as personal computers and mobiles, opens new opportunities in the flip chip market.

Market Report Coverage –

Introduction

Flip Chips Market Segmentation –

By Industry

• Healthcare
• Automotive
• Telecom
• Aerospace & Defence
• Others

By Packaging Technology

• 2D IC
• 3D IC
• 5D IC                              

By Bumping Technology

• Solder Bumping
• Gold Bumping
• Copper Bumping
• Others

By Country

• U.S
• Canada
• Mexico